Electromagnetic interference (EMI) issues for mixed-signal System-on-Package (SOP)

Proceedings - Electronic Components and Technology Conference

Volumn 2, Issue , 2004, Pages 1437-1442

  Sasaki, Hideki ^b   Govind, Vinu ^a   Srinivasan, Krishna ^a   Dalmia, Sidharth ^a   Sundaram, Venky ^a   Swaminathan, Madhavan ^a   Tummala, Rao ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

^b NEC CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE; CAPACITORS; DATA STORAGE EQUIPMENT; DIGITAL CIRCUITS; DIGITAL SIGNAL PROCESSING; ELECTRIC INDUCTORS; INTERMODULATION; PERMITTIVITY; SIGNAL GENERATORS; SYSTEMS ANALYSIS; TRANSISTORS;

ANALOG CIRCUITS; MIXED SIGNALS; NOISE AMPLIFIERS; SWITCHING NOISE; SYSTEM-ON-PACKAGE (SOP);

SIGNAL INTERFERENCE;

EID: 4544365814     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)

1. nd Electronic Components and Technology Conf, May 2002, pp. 646-650.
2. Shen, M. et al, "Cost and Performance Analysis for Mixed-Signal System Implementation: System-on-Chip or System-on-Package?," IEEE Trans-CPMT-C, Vol. 25, No. 4 (2002), pp. 262-272.
3. th Topical Meeting on Electrical Performance of Electronic Packaging, Oct 2002, pp. 67-70.
4. Razavi, B., RF Microelectronics, Prentice-Hall (New York, 1999), Chapter 2.
5. Moran, T. E. et al, "Methods to Reduce Radiation From Split Ground Planes in RF and Mixed Signal Packaging Structure," IEEE Trans-CPMT-B, Vol. 25, No. 3 (2002), pp. 409-416.
6. Cui, W. et al, "EMI Resulting From a Signal Via Transition Througth DC Power Bus - Effectiveness of Local SMT Decoupling," Proc Asia-Pacific Conference on Environmental Electromagnetics CEEM, China, May. 2000, pp. 91-95.
7. th Electronic Components and Technology Conf, June 2004, to be published.