Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures

IEEE Transactions on Advanced Packaging

Volumn 25, Issue 3, 2002, Pages 409-416

  Moran, Tamir E ^a   Virga, Kathleen L ^b   Aguirre, Gerardo ^c   Prince, John L ^b  

^a AGILENT TECHNOLOGIES   (United States)

^b University of Arizona   (United States)

^c Res and New Prod Development Group   (United States)

Author keywords

Coupling; EMI; FDTD; Mixed signal packaging; Radiated emissions

Indexed keywords

DIGITAL CIRCUITS; FINITE DIFFERENCE METHOD; NATURAL FREQUENCIES; SIGNAL INTERFERENCE; TIME DOMAIN ANALYSIS;

MIXED SIGNAL PACKAGING STRUCTURES;

SIGNAL THEORY;

EID: 0036706303     PISSN: 15213323     EISSN: None     Source Type: Journal    
DOI: 10.1109/TADVP.2002.805997     Document Type: Conference Paper

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