Thermal stability of titanium nitride diffusion barrier films for advanced silver interconnects

Microelectronic Engineering

Volumn 76, Issue 1-4, 2004, Pages 76-81

  Gao, L ^a   Gstottner J ^a   Emling, R ^a   Balden, M ^b   Linsmeier, Ch ^b   Wiltner, A ^b   Hansch, W ^a   Schmitt Landsiedel, D ^a  

^a TECHNICAL UNIVERSITY OF MUNICH   (Germany)

^b MAX PLANCK INSTITUT FÜR PLASMAPHYSIK   (Germany)

Author keywords

Diffusion barrier; Silver metallization; Thermal annealing; TiN

Indexed keywords

ANNEALING; ATOMIC FORCE MICROSCOPY; DIFFUSION IN SOLIDS; METALLIZING; MORPHOLOGY; MULTILAYERS; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC STABILITY; TITANIUM NITRIDE; X RAY DIFFRACTION; X RAY PHOTOELECTRON SPECTROSCOPY;

DIFFUSION BARRIERS; SILVER METALLIZATION; SIZE EFFECT; THERMAL ANNEALING;

THIN FILMS;

EID: 4544357960     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.07.020     Document Type: Conference Paper

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