EUV blank inspection

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 6792, Issue , 2008, Pages

  Peters, J H ^a   Tonk, C ^a   Spriegel, D ^b   Han, Hak Seung ^c   Cho, Wonil ^c   Wurm, Stefan ^c  

^a Advanced Mask Technology Center   (Germany)

^b SIEMENS AG   (Germany)

^c SEMATECH   (United States)

Author keywords

Detection sensitivity; EUV blank inspection; Multi layer defects

Indexed keywords

(I ,J) CONDITIONS; (OTDR) TECHNOLOGY; BLANK MATERIAL; DEFECT FREE; DEFECT FREE MASKS; DRESDEN; EUROPEAN; EUV BLANK; EUV MASKS; EXTREME ULTRA-VIOLET (EUV); LAYER THICKNESSES; MASK BLANK DEVELOPMENT CENTER (MBDC); MASK MAKERS; MATERIAL LAYERS; MULTILAYER (ML); OPTICAL (PET) (OPET); SEMATECH (CO); SIEMENS (C0); STRUCTURING PROCESS;

BOUNDARY CONDITIONS; BOUNDARY VALUE PROBLEMS; COMPUTER NETWORKS; INSPECTION; MASKS; MULTITASKING; NANOSTRUCTURED MATERIALS; PRINTING; SPECIFICATIONS; TECHNOLOGY; TOOLS; ULTRAVIOLET DEVICES; WELL STIMULATION;

DEFECTS;

EID: 44949127977     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.798594     Document Type: Conference Paper

References (8)

1. Proposed new standard, SEMI SNARF Blank ID, 8. Oct. 2007
2. MEDEA Project 2T302 MUSCLE - "Masks through user's supply chain: leadership by excellence", EMLC 2007, Grenoble
3. ITRS Roadmap 2006 Update
4. A. Barty, K.A. Goldberg, P. Kearney, S.B. Rekawa, B. LaFontaine, O. Wood, J.S. Taylor, H.S. Han, "Multilayer defects nucleated by substrate pits: a comparison of actinic inspection and non-actinic inspection techniques", Photomask Technology 2006, Proceeding of SPIE, Vol. 6349, (2006)
5. T. Terasawa, Y. Tezuka, M. Ito, T. Tomie, "High Sped Actinic EUV Mask Blank Inspection with Dark-Field Imaging", BACSU News, January 2005, Volume 21, Issue 1
6. K. Hamamoto, Y. Tanaka, T. Yoshizumi, Y. Fukushima, H. Shiotani, N. Sakaya, M. Hosoya, T. Shoki, T. Watanabe, H. Kinoshita, "Pahse Defect Observation Using an EUV Microscope", Proceeding of SPIE, Vol.6151, (2006)
7. ABBILD project funded by the German Federal Ministry of Education and Research (BMBF) under contract number 01M3154A ("Abbildungsmethodiken für Nanoelektronische Bauelemente" - ABBILD)
8. Wonil Cho, Hak-Seung Han, Kenneth A. Goldberg, Patrick A. Kearney, Chan-Uk Jeon, "Detectability and printability of EUVL-mask blank defects fort he 32-nm HP node", Photomask Technology 2007, Proceedings of SPIE, Vol. 6730, (2007)