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Volumn , Issue , 2007, Pages 245-250

Thermal analyses of a multilayer with embedded vertical-cavity surface emitting lasers

Author keywords

Optical polymer; Thermal conductivity measurement; Thermal via; Two photon absorption (TPA)

Indexed keywords

ADHESIVES; DATA PROCESSING; ELECTRONICS INDUSTRY; INDUSTRIAL APPLICATIONS; LASERS; MICROELECTRONICS; OPTICAL DESIGN; PHOTONICS; SURFACE EMITTING LASERS; TECHNOLOGY; THERMOANALYSIS;

EID: 44849115341     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/POLYTR.2007.4339176     Document Type: Conference Paper
Times cited : (6)

References (13)
  • 3
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    • Leising, G, Klamminger, A, Langer, G, Schmidt, V, Reitzer, R, Leiterplattenelement mit wenigstens einem Licht-Wellenleiter sowie Verfahren zur Herstellung eines solchen Leiterplattenelements, Austrian Patent AT 413891, Dec. 2003
    • Leising, G., Klamminger, A., Langer, G., Schmidt, V., Reitzer, R., "Leiterplattenelement mit wenigstens einem Licht-Wellenleiter sowie Verfahren zur Herstellung eines solchen Leiterplattenelements", Austrian Patent AT 413891, Dec. 2003.
  • 4
    • 0033545112 scopus 로고    scopus 로고
    • Three-dimensional optical circuitry using two-photon-assisted polymerization
    • Joshi, M. P., Pudavar, H. E., Swiatkiewicz, J., Prasad, P. N., Reianhardt, B. A., "Three-dimensional optical circuitry using two-photon-assisted polymerization", App. Phys. Letters, Vol. 74, No. 2, pp. 170-172, 1999.
    • (1999) App. Phys. Letters , vol.74 , Issue.2 , pp. 170-172
    • Joshi, M.P.1    Pudavar, H.E.2    Swiatkiewicz, J.3    Prasad, P.N.4    Reianhardt, B.A.5
  • 6
    • 0027595051 scopus 로고
    • Modeling temperature effects and spatial hole burning to optimize vertical-cavity surface-emitting laser performance
    • Scott, J.W., Geels, R.S., Corzine, S.W., Coldren, L.A., "Modeling temperature effects and spatial hole burning to optimize vertical-cavity surface-emitting laser performance", IEEE J. Quantum Electronics, Vol. 29, No 5, pp. 1295-1308, 1993.
    • (1993) IEEE J. Quantum Electronics , vol.29 , Issue.5 , pp. 1295-1308
    • Scott, J.W.1    Geels, R.S.2    Corzine, S.W.3    Coldren, L.A.4
  • 7
    • 49949102792 scopus 로고    scopus 로고
    • Temperature Analysis of Threshold Current in Infrared Vertical-Cavity Surface-Emitting Lasers
    • Oct
    • Chen, C., Leisher, P.O., Allerman, A.A., Geib, K.M., Choquette, K.D., "Temperature Analysis of Threshold Current in Infrared Vertical-Cavity Surface-Emitting Lasers", IEEE J. Quantum Electronics, Vol. 42, No. 10, pp. 1078-1083, Oct. 2006.
    • (2006) IEEE J. Quantum Electronics , vol.42 , Issue.10 , pp. 1078-1083
    • Chen, C.1    Leisher, P.O.2    Allerman, A.A.3    Geib, K.M.4    Choquette, K.D.5
  • 8
    • 34548162040 scopus 로고    scopus 로고
    • The effects of stress, temperature, and spin flips on polarization switching in vertical-cavity surface-emitting lasers
    • Van der Sande, G., Peeters, M., Veretennicoff, I., Danckaert, J., Verschaffelt, G., Balle, S., "The effects of stress, temperature, and spin flips on polarization switching in vertical-cavity surface-emitting lasers", IEEE J. Quantum Electronics, Vol. 42, No. 9, pp. 898-906, 2006.
    • (2006) IEEE J. Quantum Electronics , vol.42 , Issue.9 , pp. 898-906
    • Van der Sande, G.1    Peeters, M.2    Veretennicoff, I.3    Danckaert, J.4    Verschaffelt, G.5    Balle, S.6
  • 9
    • 1642618482 scopus 로고    scopus 로고
    • Temperature sensitivity of injection-locked vertical-cavity surface-emitting lasers
    • March
    • Chlouverakis, K.E., Adams, M.J., "Temperature sensitivity of injection-locked vertical-cavity surface-emitting lasers", IEEE J. Quantum Electronics, Vol. 40, No. 3, pp. 189-196, March 2004.
    • (2004) IEEE J. Quantum Electronics , vol.40 , Issue.3 , pp. 189-196
    • Chlouverakis, K.E.1    Adams, M.J.2
  • 13
    • 46449100753 scopus 로고    scopus 로고
    • Minimization of the Thermal Interface Resistance of Power SMD Assemblies for High-Temperature Applications
    • Germany, IEEE Catalog Number: 06EX1493C, ISBN: 1-4244-0551-3, pp, May 10-14
    • Nicolics, J., Mündlein, M., Fasching, M., "Minimization of the Thermal Interface Resistance of Power SMD Assemblies for High-Temperature Applications", IEEE Proc. of 29th Int. Spring Seminar on Electronics Technology, ISSE 2006, St. Marienthal, Germany, IEEE Catalog Number: 06EX1493C, ISBN: 1-4244-0551-3, pp. 49-54, May 10-14, 2006.
    • (2006) IEEE Proc. of 29th Int. Spring Seminar on Electronics Technology, ISSE 2006, St. Marienthal , pp. 49-54
    • Nicolics, J.1    Mündlein, M.2    Fasching, M.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.