Hybrid spectral/finite element analysis of dynamic delamination of patterned thin films

Engineering Fracture Mechanics

Volumn 75, Issue 14, 2008, Pages 4217-4233

  Tran, Phuong ^a   Kandula, Soma Sekhar V ^a   Geubelle, Philippe H ^a   Sottos, Nancy R ^a  

^a University of Illinois at Urbana Champaign   (United States)

Author keywords

Adhesion; Cohesive model; Delamination; Dynamic fracture; Laser pulse; Spectral method; Thin film

Indexed keywords

ADHESION; CRACKS; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; SPECTRUM ANALYSIS; STRESS CONCENTRATION; THIN FILMS;

COHESIVE MODEL; DECOHESION; ELASTODYNAMIC; INTERFACIAL DEBONDING; TRACTION STRESS EVOLUTION;

DELAMINATION;

ADHESION; CRACKS; DELAMINATION; FINITE ELEMENT METHOD; FRACTURE TOUGHNESS; SPECTRUM ANALYSIS; STRESS CONCENTRATION; THIN FILMS;

EID: 44549087059     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2008.03.006     Document Type: Article

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