Crack detection in single-crystalline silicon wafers using impact testing

Applied Acoustics

Volumn 69, Issue 8, 2008, Pages 755-760

  Hilmersson, C ^a   Hess, D P ^a   Dallas, W ^a   Ostapenko, S ^a  

^a UNIVERSITY OF SOUTH FLORIDA   (United States)

Author keywords

Audible; Crack; Detection; Silicon wafer; Solar cell; Vibration

Indexed keywords

AMPLITUDE MODULATION; CRACK DETECTION; IMPACT TESTING; NATURAL FREQUENCIES; QUALITY CONTROL; SINGLE CRYSTALS; SOLAR CELLS;

AUDIO VIBRATION; PEAK AMPLITUDES; PERIPHERY CRACKS;

SILICON WAFERS;

EID: 44449155277     PISSN: 0003682X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apacoust.2007.03.002     Document Type: Article

References (8)

1. Belyaev A., Polupan O., Ostapenko S., Hess D.P., and Kalejs J.P. Resonance ultrasonic vibration diagnostics of elastic stress in full-size silicon wafers. Semicond Sci Technol 21 (2006) 254-260
2. Rueland E, Herguth A, Trummer A, Wansleben S, Fath P. μ-Crack detection and other optical characterization techniques for in-line inspection of wafers an cells. In: Proceedings of 20th EU PVSEC, Barcelona; 2005. p. 3242-45.
3. Rakotoniaina JP, Breitenstein O, Al Rifai MH, Franke D, Schnieder A. Detection of cracks in silicon wafers and solar cells by lock-in ultrasound thermography. In: Proceedings of PV Solar conference, Paris; 2004. p. 640-3.
4. Trupke T., Bardos R.A., Schubert M.C., and Warta W. Photoluminescence imaging of silicon wafers. Appl Phys Lett 89 4 (2006) 44107
5. Fuyuki T., Kondo H., Yamazaki T., Takahashi Y., and Uraoka Y. Photographic surveying of minority carrier diffusion length in polycrystalline silicon solar cells by electroluminescence. Appl Phys Lett 86 (2005) 262108
6. Belyaev A., Polupan O., Dallas W., Ostapenko S., and Hess D. Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers. Appl Phys Lett 88 (2006) 111907
7. Best S.R., Hess D.P., Belyaev A., Ostapenko S., and Kalejs J.P. Audible vibration diagnostics of thermo-elastic residual stress in multi-crystalline silicon wafers. Appl Acoust 67 (2006) 541-549
8. Bendat J.S., and Piersol A.G. Engineering application of correlation and spectral analysis (1980), Wiley