Crack detection and analyses using resonance ultrasonic vibrations in full-size crystalline silicon wafers

Applied Physics Letters

Volumn 88, Issue 11, 2006, Pages

  Belyaev, A ^a   Polupan, O ^a   Dallas, W ^a   Ostapenko, S ^a   Hess, D ^a   Wohlgemuth, J ^b  

^a UNIVERSITY OF SOUTH FLORIDA   (United States)

^b BP Solar International LLC ^*  (United States)

Author keywords

[No Author keywords available]

Indexed keywords

REAL-TIME FREQUENCY RESPONSE; RESONANCE ULTRASONIC VIBRATIONS (RUV) TECHNIQUE; ULTRASONIC VIBRATIONS;

FREQUENCY RESPONSE; RESONANCE; SILICON WAFERS; TRANSDUCERS; ULTRASONIC WAVES; VIBRATIONS (MECHANICAL);

CRACK PROPAGATION;

EID: 33645132277     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2186393     Document Type: Article

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