Losses caused by roughness of metallization in printed-circuit boards

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn 2005, Issue , 2005, Pages 39-42

  Deutsch, A ^a,b,c   Surovic, C ^d   Krabbenhott, R ^d   Kopcsay, G V ^d   Chamberlin, B ^d  

^a IBM T J WATSON RESEARCH CENTER   (United States)

^b IBM   (United States)

^c IBM MICROELECTRONICS   (United States)

^d NONE

Author keywords

[No Author keywords available]

Indexed keywords

BROADBAND MODELING; CROSS SECTIONS; METAL ROUGHNESS; SIGNAL INTEGRITY;

BROADBAND NETWORKS; ELECTRIC LOSSES; INTERCONNECTION NETWORKS; MATHEMATICAL MODELS; METALLIZING; SIGNAL PROCESSING;

PRINTED CIRCUIT BOARDS;

EID: 33845873590     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPEP.2005.1563695     Document Type: Conference Paper

References (7)

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2. http://www.gould.com/cf_jtc.htm
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4. G. Brist, S. Hall, S. Clouser, T. Liang, "Non-Classical Conductor Losses Due to Copper Foil Roughness and Treatment"', digest ECWC10 Conference at APEX IPC Printed Circuits Expo and Designers Summit 2005, pp. 1-11, Feb. 22-24, 2005, Anaheim, CA.
5. Z. Zhu and J. White, "FastSies: a fast stochastic integral equation solver for modeling the rough surface effect" submitted to, ICCAD 2005.
6. L. Proekt and A. C. Cangellans, "Investigation of the Impact of Conductor Surface Roughness on Interconnect Frequency-Dependent Ohmic Loss", 2003 ECTC Conference, pp.1004-1010, June 2003, New Orleans, LA.
7. W. T. Weeks, L. L. Wu, M. F. McAllister, and A. Singh, "Resistive and inductive skin effect in rectangular conductors", IBM. J. Res. And Dev., vol. 23, pp.652-660, 1979.