A flow network analysis of a liquid cooling system that incorporates microchannel heat sinks

Thermomechanical Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn 1, Issue , 2004, Pages 714-721

  Radmehr, Amir ^a   Patankar, Suhas V ^a  

^a Innovative Research Inc   (United States)

Author keywords

CFD; Flow Network Modeling; FNM; Heat sink; Liquid cooling; Microchannel; Thermal design

Indexed keywords

FLOW NETWORK MODELING; LIQUID COOLING SYSTEMS; MICROCHANNEL; THERMAL DESIGN;

COMPUTATIONAL FLUID DYNAMICS; HEAT FLUX; HEAT SINKS; HEAT TRANSFER COEFFICIENTS; PRANDTL NUMBER; PRESSURE DROP; REYNOLDS NUMBER; THERMAL CONDUCTIVITY; THERMOANALYSIS;

COOLING SYSTEMS;

EID: 4444344934     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (11)

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