Analytical and experimental hybrid study on thermal fatigue strength of electronic solder joints: (2nd report, evaluation by isothermal mechanical fatigue tests)

Nihon Kikai Gakkai Ronbunshu, A Hen/Transactions of the Japan Society of Mechanical Engineers, Part A

Volumn 64, Issue 619, 1998, Pages 558-563

  Yu, Qiang ^a   Shiratori, Masaki ^a   Kaneko, Seiji ^a   Ishihara, Tatsuya ^a   Wang, Shubo ^a  

^a NONE

Author keywords

Accelerated test; Finite element method; Low cycle fatigue; Mechanical fatigue test; Microelectronic solder joint; Strain rate; Thermal fatigue strength

Indexed keywords

EID: 71249124004     PISSN: 03875008     EISSN: None     Source Type: Journal    
DOI: 10.1299/kikaia.64.558     Document Type: Article

References (9)

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3. Dasgupta, a., Oyan, C, Baker, D. and Pecht, M., Trans. ASME, 114, (1992), 152-160.
4. Uegai, Y., Tani, S., Inoue, A. and Yoshioka, S., Advances in Electronic Packaging, EEP-voI. 4-1 (1993), 493-498, ASME.
5. Pan, T-Y., "Thermal Cycling Induced Plastic Deformation in Solder Joints-part 1: Accumulated Deformation in Surface Mount Joints," Trans. ASME, J. Elect ionic Packaging, 113 (1991), 8-15.