Forced convection heat transfer for swaged mixed metal heatsinks

InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

Volumn 2002-January, Issue , 2002, Pages 315-322

  Zaghlol, A ^a   Hermann, K ^a   Butler, J ^a   Teertstra, Peter ^b   Culham, Richard ^b  

^a R Theta Inc   (Canada)

^b UNIVERSITY OF WATERLOO   (Canada)

Author keywords

Aluminum; Conducting materials; Copper; Electrical resistance measurement; Heat sinks; Heat transfer; Temperature measurement; Thermal conductivity; Thermal force; Thermal resistance

Indexed keywords

ALUMINUM; COPPER; FINS (HEAT EXCHANGE); FORCED CONVECTION; HEAT CONVECTION; HEAT RESISTANCE; HEAT SINKS; HEAT TRANSFER; REYNOLDS NUMBER; TEMPERATURE MEASUREMENT; WIND TUNNELS;

APPROACH VELOCITIES; CONDUCTING MATERIALS; ELECTRICAL RESISTANCE MEASUREMENT; EXPERIMENTAL INVESTIGATIONS; FIN MATERIALS; THERMAL FORCES; THERMAL PERFORMANCE; VERTICAL WIND TUNNEL;

THERMAL CONDUCTIVITY;

EID: 84950140064     PISSN: 19363958     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ITHERM.2002.1012473     Document Type: Conference Paper

References (5)

1. H.W. Chu, C.L. Belady and C.D. Patel, "A Survey of High-performance, High Aspect Ratio, Air Cooled Heat Sinks", 1999 International Systems Packaging Symposium, Jan. 11-13, 1999, San Diego, California, USA.
2. H. Jonsson and B. Palm, "Influence of Airflow Bypass on the Thermal performance and Pressure Drop of Plate Fin and Pin Fin Heat Sinks for Electronics Cooling", Proceedings of Eurotherm Sem. No. 58, Nantes, France, Sept. 24-26, 1997, pp. 44-50.
3. Robert W. Messler Jr., Joining of Advanced Materials, Stoneham, MA, 1993.
4. R-Theta Catalogues.
5. th IEEE Symposium, March 9-11, 1999, San Diego, California, USA.