Microstructurally based finite element simulation on solder joint behaviour

Soldering and Surface Mount Technology

Volumn 9, Issue 1, 1997, Pages 35-41

  Frear, D R ^a   Burchett, S N ^a   Neilsen, M K ^a   Stephens, J J ^a  

^a SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

Finite element simulation; Reliability; Solder joint

Indexed keywords

COMPUTER SIMULATION; EUTECTICS; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; MICROSTRUCTURE; RELIABILITY; STRAIN;

CYCLIC STRAIN; FINITE ELEMENT SIMULATION; INTERNAL STATE VARIABLES; THERMOMECHANICAL FATIGUE;

SOLDERED JOINTS;

EID: 4444253453     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (12)

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