An optimized model of skin effect for on-chip spiral inductors

IEEE Radio Frequency Integrated Circuits Symposium, RFIC, Digest of Technical Papers

Volumn , Issue , 2004, Pages 445-448

  Sun, X ^a   Carchon, G ^a   De Raedt, W ^a  

^a IMEC   (Belgium)

Author keywords

Lumped element model; Mutual inductance; On chip spiral inductor; Skin effect network; Wafer level packaging

Indexed keywords

LIMPED-ELEMENT MODELS; MUTUAL INDUCTANCE; ON-CHOIP SPIRALINDUCTORS; SKIN EFFECT NETWORK; WAFER LEVEL PACKAGING;

COMPUTER SIMULATION; FREQUENCIES; INDUCTANCE; MATHEMATICAL MODELS; MICROWAVES; RESISTORS; RESONANCE; SKIN EFFECT;

ELECTRIC INDUCTORS;

EID: 4444250829     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)

1. D. Melendy et al., "A New Scalable Mode for Spiral Inductors on Lossy Silicon Substrate", IEEE MTT-S Digest, pp. 1007-1010, 2003.
2. F. M. Rotella et al., "A Broad-Band Scalable Lumped-Element Inductor Model using Analytic Expressions to Incorporate Skin Effect, Substrate Loss and Proximity Effect", IEDM Technical Digest, DEC. 2002
3. A.E. Ruehli, "Inductance calculation in a complex integrated circuits environment', IBM J. Res. Dev. 1972, pp. 470-480
4. X. Sun et al., "Analysis of High-Q Inductors Realized using Wafer-Level Packaging Techniques," IEEE 53rd Electronic Components and Technology Conference symposium Digest, pp. 1510-1515, New Orleans, May 27-30, 2003
5. G. Carchon et al. "High-Q RF Inductors on Standard Silicon Realized using Wafer-Level Packaging Techniques," presented at IEEE MTT-S Digest, Philadelphia, PA, pp. 1287-1290, June 8-13, 2003.
6. A. Watson et al., "Wide-Band Distributed Modeling of Spiral Inductors in RFICs," IEEE MTT-S Digest, pp. 1011-1014, 2003.