Wide-band distributed modeling of spiral inductors in RFICs

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2003, Pages 1011-1014

  Watson, Adam ^a   Francis, Pascale ^b   Hwang, Kyuwoon ^b   Weisshaar, Andreas ^a  

^a Oregon State University   (United States)

^b NATIONAL SEMICONDUCTOR CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC IMPEDANCE; NATURAL FREQUENCIES; SILICON; SUBSTRATES;

SILICON SUBSTRATES;

ELECTRIC INDUCTORS;

EID: 0042092327     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. J. R. Long and M. A. Copeland, "The Modeling, Design, and Characterization of Monolithic Inductors for Silicon RF IC's," IEEE J. Solid-State Circuits, vol. 32, pp. 357-368, Mar. 1997.
2. S.S. Mohan, M.d.M. Hershensen, S.P. Boyd, and T.H. Lee, "Simple Accurate Expressions for Planar Spiral Inductors," IEEE J. Solid-State Circuits, vol. 34, pp. 1419-1424, Oct. 1999.
3. D. Melendy, P. Francis, C. Pichler, K. Hwang, G. Srinivasan, and A. Weisshaar, "A New Wide-Band Compact Model for Spiral Inductors in RFICs," IEEE Electron Device Lett., vol 23, pp. 273-275.
4. nd Ed. John Wiley and Sons, 1998.
5. J. N. Burghartz, D. C. Edelstein, K. A. Jenkins, and Y. H. Kwark, "Spiral Inductors and Transmission Lines in Silicon Technology Using Copper-Damascene Interconnects and Low-Loss Substrates," IEEE Trans. Microwave Theory Tech., vol. 45, pp.1961-1968, Oct. 1997.
6. J. Zheng, V. K. Tripathi, and A. Weisshaar, "Characterization and Modeling of Multiple Coupled On-Chip Interconnects on Silicon Substrate," IEEE Trans. Microwave Theory Tech., vol. 49, pp. 1733-1739, Oct. 2001.
7. D. Melendy, P. Francis, C. Pichler, K. Hwang, G. Srinivasan, and A. Weisshaar, "Wide Band Compact Modeling of Spiral Inductors in RFICs," IEEE MTT-S International Microwave Symposium Digest, pp. 717-720, June 2002.
8. E. C. Levy, "Complex-Curve Fitting," IRE Trans. Automatic Control, vol. 4, pp. 37-43, May 1959.