High-Q RF inductors on standard silicon realized using wafer-level packaging techniques

IEEE MTT-S International Microwave Symposium Digest

Volumn 2, Issue , 2003, Pages 1287-1290

  Carchon, G ^a   Jenei, S ^a   Carbonell, L ^a   Van Hove, M ^a   Decoutere, S ^a   De Raedt, W ^a   Maex, K ^a   Beyne, E ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; NATURAL FREQUENCIES; PASSIVATION; Q FACTOR MEASUREMENT; SILICON WAFERS;

WAFER-LEVEL PACKAGING (WLP);

ELECTRIC INDUCTORS;

EID: 0042593026     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. R. Groves, et al., "High Q inductors in a SiGe BiCMOS process utilizing a thick metal process add-on module," IEEE BCTM, Minneapolis, MN, pp. 149-152, Sept, 26-28, 1999.
2. G. Carchon, et al., "Integrated Inductors," in Integrated Passive Component Technology, to be published by IEEE Press, ISBN 0471244317, 2003, chapter 10.
3. S. Jenei, et al. "Add-on Cu/SILK Module for High Q inductors," IEEE Electron Device Letters, vol. 23, pp. 173-175, 2002.
4. J. Rogers, et al., "Post-processed inductors with application to a completely integrated 2 GHz VCO," IEEE Trans. on Electron Devices, vol. 48, pp. 1284-1287, 2001.
5. X. Huo, et al., "Silicon-based high-Q inductors incorporating electroplated copper and low-K. BCB dielectric," IEEE Electron Device Letters, vol. 23, pp. 520-522, 2002.
6. G. Carchon, et al., "High-Q inductors on low resistivity silicon through wafer post-processing," IMAPS Denver, pp. 604-609, 2002.
7. G. Carchon, et al., "Multi-layer thin film MCM-D for the integration of high-performance wireless front-end systems," Microwave Journal, vol. 44, pp. 96-110, 2001.
8. C. P. Yue and S. S. Wong, "On-chip spiral inductors with patterned ground shields for Si-based RF IC's," IEEE Journal of Solid-State Circuits, vol. 33, pp. 743-752, 1998.