Cooling of Thermal Enhanced BGA Package Using Foam Metal Heat Sinks

American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD

Volumn 366, Issue , 2000, Pages 399-405

  Hwang, Jenn Jiang ^a   Chao, Chung Hsing ^b  

^a CHUNG HUA UNIVERSITY   (Taiwan)

^b Industial Technol Res Institute   (Taiwan)

Author keywords

BGA Package; Electronic Equipment Cooling; Foam Metal Heat Sinks

Indexed keywords

EID: 0345813321     PISSN: 02725673     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)

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