Lead-free photoimageable silver conductor paste formulation for high density electronic packaging

Materials Science and Engineering: B

Volumn 132, Issue 1-2, 2006, Pages 215-221

  Ketkar, Supriya A ^a   Umarji, Govind G ^a   Phatak, Girish J ^a   Ambekar, Jalindar D ^a   Rao, I C ^a   Mulik, Uttam P ^a   Amalnerkar, Dinesh P ^a  

^a CENTRE FOR MATERIALS FOR ELECTRONICS TECHNOLOGY C MET   (India)

Author keywords

Electrical measurements; Electron microscopy; Fritless binder; Photoimageable thick films

Indexed keywords

BISMUTH COMPOUNDS; BOROSILICATE GLASS; ELECTRIC CONDUCTORS; ELECTRIC RESISTANCE; ELECTRON MICROSCOPY; SCANNING ELECTRON MICROSCOPY;

ELECTRICAL MEASUREMENTS; FRITLESS BINDER; MINIMAL LINE SHRINKAGE; PHOTOIMAGEABLE THICK FILMS;

ELECTRONICS PACKAGING;

EID: 33746736223     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2006.02.027     Document Type: Article

References (10)

1. John H. Lau, S.W. Ricky Lee, 1st ed., Microvias, McGraw Hill, 2001.
2. Umarji G.G., Ketkar S.A., Phatak G.J., Seth T., Mulik U.P., and Amalnerkar D.P. Mater. Lett. 59 4 (2005) 503-509
3. Ketkar S.A., Umarji G.G., Phatak G.J., Ambekar J.D., Mulik U.P., and Amalnerkar D.P. Mater. Chem. Phys 96 1 (2005) 145-153
4. Vest R.W. Ceram. Bull. 65 4. (1986)
5. Ogawa T., Ootani M., Asai T., Hasegawa M., and Ito O. IEEE Trans. compon. pack. manuf. technol. - Part A 17 4. (1994)
6. B. Dziurdzia, St. Nowak, H. Thust, T. Frisch, E. Polzer, W. Gregorczyk, 43rd International scientific colloquim, Technical University of Ilmenau, Sept 21-24 (1998).
7. Rane S.B., Ghatpande M.S., Seth T., Phatak G.J., and Amalnerkar D.P. Trans. SAEST 37 (2002) 95-98
8. Stefen Muckett, Dr. Jurate Minalgene, Advances in Super Fine Line Thick film Materials & Processing Proc: Microelectronics Proceeding, (2004) 154.
9. Skurski M.A., Smith M.A., Draudt R.R., Amey D.I., Horowitz S.J., and Champ M.J. Int. J. Microcirc. Electron. Packag. 21 4 (1998) 355-362
10. S. J. Horowitz and D. I. Amey, DuPont Microcircuit Materials, Private Communication, 2002.