Studies of polymer deformation and recovery in micro hot embossing

Microsystem Technologies

Volumn 14, Issue 7, 2008, Pages 1055-1060

  Shan, Xuechuan ^a   Liu, Y C ^a   Lam, Y C ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

GLASS TRANSITION; HIGH TEMPERATURE EFFECTS; MICROMACHINING; MICROSTRUCTURE; PLASTIC DEFORMATION;

GLOBAL FLATNESS; HIGHER EMBOSSING TEMPERATURE; MICRO HOT EMBOSSING;

POLYMETHYL METHACRYLATES;

EID: 44249109514     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0486-y     Document Type: Conference Paper

References (6)

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3. Hodzica A, Stachurski ZK, Kim JK (2000) Nano-indentation of polymer-glass interfaces. J Polym 41:6895-6905
4. Rowland HD, King WP (2004) Polymer deformation and filling modes during micro embossing. J Micromech Microeng 14:1625-1632
5. Schift H, Heyderman LJ (2003) Nanorheology. In: Sotomayor Torress CW (ed) Alternative lithography, Kluwer Academic/Plenum Publishers, pp 37-176
6. Shan XC, Ikehara T, Murakoshi Y, Maeda R (2005) Applications of micro hot embossing for optical switch formation. Sens Actuators A 119:433-440