-
1
-
-
0001622929
-
Dynamischer Avalanche beim Abschalten von. GTO-Thyristoren und IGBTs
-
Schlangenotto H., and Neubrand H. Dynamischer Avalanche beim Abschalten von. GTO-Thyristoren und IGBTs. Archiv. Elektrotechnik. 72 (1989) 113-123
-
(1989)
Archiv. Elektrotechnik.
, vol.72
, pp. 113-123
-
-
Schlangenotto, H.1
Neubrand, H.2
-
2
-
-
0033640299
-
Current filamentation in bipolar power devices during dynamic avalanche breakdown
-
Oetjen J., Jungblut R., Kuhlmann U., Arkenau J., and Sittig R. Current filamentation in bipolar power devices during dynamic avalanche breakdown. Solid State Electron. 44 (2000) 117
-
(2000)
Solid State Electron.
, vol.44
, pp. 117
-
-
Oetjen, J.1
Jungblut, R.2
Kuhlmann, U.3
Arkenau, J.4
Sittig, R.5
-
3
-
-
0026168678
-
Analytical model for the destruction mechanism of GTO-like devices by avalanche injection
-
Wachutka G. Analytical model for the destruction mechanism of GTO-like devices by avalanche injection. IEEE Trans. Electron. Devices 38 (1991) 1516-1523
-
(1991)
IEEE Trans. Electron. Devices
, vol.38
, pp. 1516-1523
-
-
Wachutka, G.1
-
4
-
-
44249121353
-
-
M. Stoisiek, G. Wachutka, D. Theis, 2D-simulations and experiments on avalanche injection in GTOs, in: Proceedings of the ISPSD'88. Tokyo, 1988.
-
M. Stoisiek, G. Wachutka, D. Theis, 2D-simulations and experiments on avalanche injection in GTOs, in: Proceedings of the ISPSD'88. Tokyo, 1988.
-
-
-
-
5
-
-
0038732707
-
On the destruction limit of Si power diodes during reverse recovery with dynamic avalanche
-
Domeij M., Lutz J., and Silber D. On the destruction limit of Si power diodes during reverse recovery with dynamic avalanche. IEEE Trans. Electron. Devices 50 (2003) 486-493
-
(2003)
IEEE Trans. Electron. Devices
, vol.50
, pp. 486-493
-
-
Domeij, M.1
Lutz, J.2
Silber, D.3
-
6
-
-
3242791629
-
Current-density patterns induced by avalanche injection phenomena in high-voltage diodes during turn-off
-
Niedernostheide F.-J., Falck E., Schulze H.-J., and Kellner-Werdehausen U. Current-density patterns induced by avalanche injection phenomena in high-voltage diodes during turn-off. Ann. Physik. 13 (2004) 414-422
-
(2004)
Ann. Physik.
, vol.13
, pp. 414-422
-
-
Niedernostheide, F.-J.1
Falck, E.2
Schulze, H.-J.3
Kellner-Werdehausen, U.4
-
7
-
-
44249088167
-
-
F.-J. Niedernostheide, E. Falck, H.-J. Schulze, U. Kellner-Werdehausen, Avalanche injection and current filaments in high-voltage diodes, in: Proceedings of the ISPS'04, Prague, 2004, pp. 75-82.
-
F.-J. Niedernostheide, E. Falck, H.-J. Schulze, U. Kellner-Werdehausen, Avalanche injection and current filaments in high-voltage diodes, in: Proceedings of the ISPS'04, Prague, 2004, pp. 75-82.
-
-
-
-
8
-
-
0036049674
-
-
P. Rose, D. Silber, A. Porst, F. Pfirsch, Investigation on the stability of dynamic avalanche in IGBTs, in: Proceedings of the ISPSD'02. Cambridge, 2002, pp. 165-168.
-
P. Rose, D. Silber, A. Porst, F. Pfirsch, Investigation on the stability of dynamic avalanche in IGBTs, in: Proceedings of the ISPSD'02. Cambridge, 2002, pp. 165-168.
-
-
-
-
9
-
-
34247538072
-
-
H.P. Felsl, E. Falck, F.-J Niedernostheide, S. Milady, S. Silber, J. Lutz, Electro-thermal simulation of current filamentation in 3.3 kV silicon p-n-n diodes with different edge terminations, in: Proceedings of the ISPSD'06, Naples, 2006.
-
H.P. Felsl, E. Falck, F.-J Niedernostheide, S. Milady, S. Silber, J. Lutz, Electro-thermal simulation of current filamentation in 3.3 kV silicon p-n-n diodes with different edge terminations, in: Proceedings of the ISPSD'06, Naples, 2006.
-
-
-
-
10
-
-
27744557590
-
-
A. Müller, F. Pfirsch, D. Silber, Trench IGBT behavior near to latch-up conditions, in: Proceedings of the ISPSD'05. Santa Barbara, 2005, pp. 255-257.
-
A. Müller, F. Pfirsch, D. Silber, Trench IGBT behavior near to latch-up conditions, in: Proceedings of the ISPSD'05. Santa Barbara, 2005, pp. 255-257.
-
-
-
-
11
-
-
0000245547
-
Avalanche characteristics and failure mechanism of high voltage diodes
-
Egawa H. Avalanche characteristics and failure mechanism of high voltage diodes. IEEE Trans.Electron. Devices vol ED-13 11 (1966) 754-758
-
(1966)
IEEE Trans.Electron. Devices
, vol.ED-13
, Issue.11
, pp. 754-758
-
-
Egawa, H.1
-
12
-
-
4043106394
-
Moving current filaments in integrated DMOS transistors under short-duration current stress
-
Denison M., Blaho M., Rodin P., Dubec V., Pogany D., Silber D., Gornik E., and Stecher M. Moving current filaments in integrated DMOS transistors under short-duration current stress. IEEE Trans. Electron. Devices 51 10 (2004) 1695-1703
-
(2004)
IEEE Trans. Electron. Devices
, vol.51
, Issue.10
, pp. 1695-1703
-
-
Denison, M.1
Blaho, M.2
Rodin, P.3
Dubec, V.4
Pogany, D.5
Silber, D.6
Gornik, E.7
Stecher, M.8
-
13
-
-
44249085249
-
-
DESSIS ISE TCAD Manual, ISE Integrated Systems Engineering AG, Zurich
-
DESSIS ISE TCAD Manual. Release 9.5 (2003), ISE Integrated Systems Engineering AG, Zurich
-
(2003)
Release 9.5
-
-
-
14
-
-
44249120869
-
-
H. Schlangenotto, private communication.
-
H. Schlangenotto, private communication.
-
-
-
|