Deposition of a-C:N films and evaluation of their robustness in electrochemical applications

Thin Solid Films

Volumn 516, Issue 16, 2008, Pages 5231-5235

  Zeng, Aiping ^a   Bilek, Marcela M M ^a   McKenzie, David R ^a   Lay, Peter A ^b  

^a UNIVERSITY OF SYDNEY   (Australia)

^b UNIVERSITY OF SYDNEY   (Australia)

Author keywords

a C:N film electrode; Deposition; Electrochemistry; Robustness

Indexed keywords

CONDUCTIVE MATERIALS; ELECTROCHEMICAL PROPERTIES; ELECTRODEPOSITION; MULTILAYER FILMS; OHMIC CONTACTS; SILICON WAFERS; VACUUM DEPOSITION;

FILTERED CATHODIC VACUUM ARC (FCVA); NON OHMIC CONTACTS; PIN HOLES; THIN FILM ELECTRODES;

THIN FILMS;

EID: 43949087505     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.07.017     Document Type: Article

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