A novel back-shooting inkjet printhead using trench-filling and SOI wafer

Sensors and Actuators, A: Physical

Volumn 114, Issue 2-3, 2004, Pages 392-397

  Baek, Seog Soon ^a   Lim, Hyung Taek ^a   Song, Hoon ^a   Kim, Yong Sung ^a   Bae, Ki Deok ^a   Cho, Chang Ho ^a   Lee, Chang Seung ^a   Shin, Jong Woo ^a   Shin S J , ^a   Kuk, Keon ^a   Oh, Yong Soo ^a  

^a Samsung Advanced Institute of Technology (SAIT)   (South Korea)

Author keywords

Nickel nozzle plate; SOI wafer; Thermal inkjet printhead; Trench isolation

Indexed keywords

ELECTROPLATING; ETCHING; FILLING; FREQUENCIES; MANUFACTURE; MONOLITHIC INTEGRATED CIRCUITS; NICKEL COMPOUNDS; NOZZLES; RELIABILITY; TRENCHING; VARIATIONAL TECHNIQUES; VELOCITY MEASUREMENT; VOLUME MEASUREMENT;

NICKEL NOZZLE PLATE; SOI WAFER; THERMAL INKJET PRINTHEAD; TRENCH ISOLATION;

SILICON WAFERS;

EID: 4344717054     PISSN: 09244247     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.sna.2003.12.023     Document Type: Article

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