Deposition of nanostructured thin films using an inductively coupled plasma chemical vapor deposition technique

Ceramics International

Volumn 30, Issue 7, 2004, Pages 1869-1872

  Lee, Y C ^a   Tan, O K ^a   Tse, M S ^a   Srivastava, A ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

Nanostructured materials; Plasma process; Tin oxide

Indexed keywords

CHEMICAL VAPOR DEPOSITION; ELECTRIC PROPERTIES; INDUCTIVELY COUPLED PLASMA; NANOSTRUCTURED MATERIALS; PARAMETER ESTIMATION; PRESSURE GAGES; SCANNING ELECTRON MICROSCOPY; TEMPERATURE MEASUREMENT; THICKNESS MEASUREMENT; TIN COMPOUNDS; X RAY DIFFRACTION ANALYSIS;

ELECTRICAL HEATERS; MASS FLOW CONTROLLERS (MFC); PLASMA PROCESSES; RESISTIVITY; TIN OXIDES; WAVELENGTHS;

THIN FILMS;

EID: 4344651023     PISSN: 02728842     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ceramint.2003.12.053     Document Type: Conference Paper

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