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Volumn 462-463, Issue SPEC. ISS., 2004, Pages 321-324

Effect of surface treatment on dielectric leakage and breakdown of copper damascene interconnects

Author keywords

Cu interconnects; Damascene; Intra level dielectric leakage; Surface treatment; TDDB

Indexed keywords

INTERMETAL DIELECTRIC (IMD); TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB); UNDOPED SILICATE GLASS (USG);

EID: 4344627599     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2004.05.093     Document Type: Article
Times cited : (6)

References (6)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.