Electrical leakage at low-K polyimide/TEOS interface

IEEE Electron Device Letters

Volumn 19, Issue 6, 1998, Pages 177-179

  Loke, Alvin L S ^a,c   Wetzel, Jeffrey T ^b,c   Stankus, John J ^b,c   Angyal, Matthew S ^b,c   Mowry, Brian K ^b   Wong, S Simon ^a,c  

^a Stanford University   (United States)

^b MOTOROLA INC   (United States)

^c IEEE   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DIELECTRIC MATERIALS; FLUORINE CONTAINING POLYMERS; INTERFACES (MATERIALS); PASSIVATION; POLYIMIDES;

ELECTRICAL ISOLATION PROBLEMS; MULTILEVEL INTERCONNECTS;

LEAKAGE CURRENTS;

EID: 0032099218     PISSN: 07413106     EISSN: None     Source Type: Journal    
DOI: 10.1109/55.678535     Document Type: Article

References (12)

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