Polymeric aperture masks for high performance organic integrated circuits

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

Volumn 22, Issue 4, 2004, Pages 1892-1895

  Muyres, Dawn V ^a   Baude, Paul F ^a   Theiss, Steven ^a   Haase, Michael ^a   Kelley, Tommie W ^a   Fleming, Patrick ^a  

^a 3M COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ORGANIC INTEGRATED CIRCUITS; POLYMERIC APERTURE MASKS; SHADOW MASKING;

ALUMINA; GOLD; LASER ABLATION; MASKS; METAL FOIL; MICROMACHINING; PHOTOCONDUCTIVITY; PHOTOLITHOGRAPHY; SEMICONDUCTING ORGANIC COMPOUNDS; SILICON; SUBSTRATES; THIN FILMS; VAPOR DEPOSITION;

INTEGRATED CIRCUITS;

EID: 4344595813     PISSN: 07342101     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1766304     Document Type: Conference Paper

References (12)

1. D. J. Gundlach, H. Klauk, C. D. Sheraw, C. C. Kuo, J. R. Huang, and T. N. Jackson, International Electron Devices Meeting Technical Digest, December 1999, pp. 111-114.
2. H. Klauk, M. Halik, U. Zschieschang, G. Schmid, and W. Radlik, J. Appl. Phys. 92, 5259 (2002).
3. T. W. Kelley, L. D. Boardman, T. D. Dunbar, D. V. Muyres, M. J. Pellerite, and T. P. Smith, J. Phys. Chem. B 107, 5877 (2003).
4. D. J. Gundlach, T. N. Jackson, D. G. Schlom, and C. F. Nelson, Appl. Phys. Lett. 74, 3302 (1999).
5. C. D. Dimitrakopoulos, S. Purushothaman, J. Kymissis, A. Callegari, and J. M. Shaw, Science 283, 822 (1999).
6. C. N. Kim, D. U. Shin, and J. M. Kim, U.S. Patent Application 20020062785, 2002.
7. G. Kim, B. Kim, and J. Brugger, 11th International Conference on Solid-State Sensors and Actuators, Munich, Germany, 10-14 June, 2001.
8. T. P. Brody, SPIE 100, 140 (1977).
9. K. Boehlen and I. Stassen Boehlen, Exitech Ltd., Oxford Park, Yarnton, Oxford, OX5 1GU United Kingdom, D. J. Gundlach, C. C. Kuo, S. F. Nelson, and T. N. Jackson, 57th Device Research Conference Digest, June 1999, p. 164.
10. M. Shtein, J. Mapel, J. Benziger, and S. Forrest, Appl. Phys. Lett. 81, 268 (2002).
11. For the surface treatment used we have published further information on the materials and processes in the following paper: T. W. Kelley, D. V. Muyres, P. F. Baude, T. P. Smith, and T. D. Jones, Mater. Res. Soc. Symp. Proc. 771, L6.5.1 (2003).
12. P. F. Baude, D. A. Ender, M. A. Haase, T. W. Kelley, D. V. Muyres, and S. D. Theiss, Appl. Phys. Lett. 82, 3964 (2003).