Tensile behavior of commercially pure copper sheet fabricated by 2- and 3-layered accumulative roll bonding (ARB) process

Metals and Materials International

Volumn 14, Issue 2, 2008, Pages 171-175

  Jang, Younghwan ^a   Kim, Sangshik ^a   Han, Seungzeon ^b   Lim, Chayong ^b   Goto, Masahiro ^c  

^a Gyeongsang National University   (South Korea)

^b Korea Institute of Material Science   (South Korea)

^c OITA UNIVERSITY   (Japan)

Author keywords

Accumulative roll bonding; Pure copper; Tensile behavior

Indexed keywords

COPPER; TENSILE STRENGTH;

ACCUMULATIVE ROLL BONDING; ACCUMULATIVE ROLL BONDING (ARB) PROCESS; COPPER SHEETS; EQUIVALENT STRAINS; PROCESS CYCLES; PURE COPPER; TENSILE BEHAVIORS;

ROLL BONDING;

EID: 43149112325     PISSN: 15989623     EISSN: None     Source Type: Journal    
DOI: 10.3365/met.mat.2008.04.171     Document Type: Article

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