The microstructural evolution during the equal channel angular pressing process and its relationship with the tensile behavior of oxygen-free copper

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 36 A, Issue 2, 2005, Pages 467-470

  Han, Seungzeon ^a   Lim, Chayong ^a   Kim, Changjoo ^a   Kim, Sangshik ^b  

^a Korea Institute of Machine and Materials   (South Korea)

^b Gyeongsang National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

CRYSTAL MICROSTRUCTURE; DIFFERENTIAL SCANNING CALORIMETRY; DISLOCATIONS (CRYSTALS); DUCTILITY; GRAIN BOUNDARIES; NANOSTRUCTURED MATERIALS; PRESSING (FORMING); STRAIN HARDENING; TENSILE PROPERTIES; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY; YIELD STRESS;

DISLOCATION DENSITY; EQUAL CHANNEL ANGULAR PRESSING (ECAP); MICROSTRUCTURAL EVOLUTION; TENSILE DUCTILITY;

COPPER;

EID: 15044363783     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-005-0318-6     Document Type: Article

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