Electron density and implication for bonding in Cu

Physical Review B - Condensed Matter and Materials Physics

Volumn 69, Issue 24, 2004, Pages

  Jiang, B ^a   Friis, J ^b   Holmestad, R ^b   Zuo, J M ^c   O'Keeffe, M ^a   Spence, J C H ^a  

^a ARIZONA STATE UNIVERSITY   (United States)

^b NORWEGIAN UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Norway)

^c University of Illinois at Urbana Champaign   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; METAL; SILVER;

ACCURACY; ARTICLE; CALCULATION; CHEMICAL BINDING; CRYSTAL; DENSITY; ELECTRIC POTENTIAL; ELECTRON DIFFRACTION; FOURIER ANALYSIS; GAMMA RADIATION; MEASUREMENT; QUANTITATIVE ANALYSIS; STRUCTURE ANALYSIS; TRANSMISSION ELECTRON MICROSCOPY;

EID: 42749102203     PISSN: 01631829     EISSN: None     Source Type: Journal    
DOI: 10.1103/PhysRevB.69.245110     Document Type: Article

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