Deposition of aerosol ("hygroscopic dust") on electronics - Mechanism and risk

Microelectronics Reliability

Volumn 48, Issue 4, 2008, Pages 584-593

  Tencer, Michal ^a,b,c  

^a UNIVERSITY OF OTTAWA   (Canada)

^b MST Consulting   (Canada)

^c NORTEL NETWORKS   (Canada)

Author keywords

[No Author keywords available]

Indexed keywords

BROWNIAN MOVEMENT; DEPOSITION; ELECTROPHORESIS; PRINTED CIRCUIT BOARDS; THERMAL GRADIENTS; THERMOPHORESIS;

BROWNIAN DIFFUSION; EQUIPMENT DESIGNS; GRAVITATIONAL SETTLING;

AEROSOLS;

EID: 42649128430     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2007.10.003     Document Type: Article

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