Magnetron sputtering process control by medium-frequency power supply parameter

Thin Solid Films

Volumn 516, Issue 14, 2008, Pages 4478-4482

  Posadowski, W M ^a   Wiatrowski, A ^a   Dora, J ^b   Radzimski, Z J ^c  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

^b Electronic Lab Equipment Engineering   (Poland)

^c Silicon Quest International   (United States)

Author keywords

Aluminium; Medium frequency magnetron sputtering

Indexed keywords

ALUMINUM COMPOUNDS; ELECTRIC POWER SUPPLIES TO APPARATUS; NATURAL FREQUENCIES; PARAMETER ESTIMATION;

MAGNETIC FIELD INTENSITY; MEDIUM-FREQUENCY MAGNETRON SPUTTERING; REACTIVE GAS PARTIAL PRESSURE; SPUTTERING TECHNOLOGY;

MAGNETRON SPUTTERING;

EID: 42649087810     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.05.077     Document Type: Article

References (10)

1. Scholl R.A. Surf. Coat. Technol. 93 (1997) 7
2. Wallace G. Thin Solid Films 351 (1999) 21
3. Posadowski W.M. Thin Solid Films 343-344 (1999) 85
4. Posadowski W.M. Proceedings of the 5th International Conference on Coatings on Glass, ICCG5, July 8 (2004) 105
5. J. Dora, Polish Patent No. 313150, 1996.
6. Berg S., and Nyberg T. Thin Solid Films 476 (2005) 215
7. Ellmer B.K., Kudella F., Mientus R., Schieck R., and Fiechter H. Thin Solid Films 247 (1994) 15
8. Malkomes N., Bierhals A., Szyszka B., and Vergöhl M. 44th Annual Technical Conference Proceedings, SVC'2001, Philadelphia, April 21-26 (2001) 13
9. Domaradzki J., Prociow E., and Kaczmarek D. Proceedings of the Fourth International Conference on Advanced Semiconductor Devices and Microsystems, ASDAM'02, Slovakia, October 14-16, IEEE 02EX531 (2002) 47
10. Prociow E., Domaradzki J., and Kaczmarek D. Proceedings of the Fourth International Conference on Advanced Semiconductor Devices and Microsystems, ASDAM'02, Slovakia, October 14-16, IEEE 02EX531 (2002) 51