메뉴 건너뛰기




Volumn 351, Issue 1-2, 1999, Pages 21-26

Design considerations for the AC/DC C-MAG® deposition source and power supply system

Author keywords

Plasma processing; Sputtering

Indexed keywords

COATED MATERIALS; COATING TECHNIQUES; ELECTRIC POWER SYSTEMS; GLASS INDUSTRY; INDUSTRIAL RESEARCH; MARKETING; PLASMA APPLICATIONS;

EID: 0033170247     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0040-6090(99)00150-9     Document Type: Article
Times cited : (9)

References (9)
  • 4
    • 33645246161 scopus 로고    scopus 로고
    • US patent applied for
    • R. Terry, US patent applied for 1998.
    • (1998)
    • Terry, R.1
  • 5
    • 33645245003 scopus 로고
    • Magnetron cathode sputtering apparatus, US patent 4,356,073 Oct.
    • H.E. McKelvey, Magnetron cathode sputtering apparatus, US patent 4,356,073 (Oct. 1982).
    • (1982)
    • McKelvey, H.E.1
  • 6
    • 33645245268 scopus 로고
    • Magnetron cathode sputtering apparatus, US patent 4,394,236 July
    • M.G. Robinson, Magnetron cathode sputtering apparatus, US patent 4,394,236 (July 1983).
    • (1983)
    • Robinson, M.G.1
  • 7
    • 33645244902 scopus 로고
    • Cathodic sputtering apparatus, US patent 4,443,318 Apr.
    • H.E. McKelvey, Cathodic sputtering apparatus, US patent 4,443,318 (Apr. 1984).
    • (1984)
    • McKelvey, H.E.1
  • 8
    • 33645245512 scopus 로고
    • Rotatable sputtering apparatus, US patent 4,445,997 May
    • H.E. McKelvey, Rotatable sputtering apparatus, US patent 4,445,997 (May. 1984).
    • (1984)
    • McKelvey, H.E.1
  • 9
    • 33645245141 scopus 로고
    • Magnetron cathode sputtering apparatus, US patent 4,466,877 Aug.
    • H.E. McKelvey, Magnetron cathode sputtering apparatus, US patent 4,466,877 (Aug. 1984).
    • (1984)
    • McKelvey, H.E.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.