Multi-layer model for stressor film deposition

International Conference on Simulation of Semiconductor Processes and Devices, SISPAD

Volumn , Issue , 2006, Pages 123-126

  Loiko, K V ^a   Adams, V ^a   Tekleab, D ^a   Winstead, B ^a   Bo, X Z ^a   Grudowski, P ^a   Goktepeli, S ^a   Filipiak, S ^a   Goolsby, B ^a   Kolagunta, V ^a   Foisy, M C ^a  

^a FREESCALE SEMICONDUCTOR INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; DEPOSITION; ELECTRIC CURRENTS; SEMICONDUCTOR MATERIALS;

MULTI-LAYER SIMULATION; STRESSOR FILM DEPOSITION;

MULTILAYER FILMS;

EID: 42549127891     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/SISPAD.2006.282853     Document Type: Conference Paper

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