Optimisation modelling for flip-chip solder joint reliability

Soldering and Surface Mount Technology

Volumn 14, Issue 1, 2002, Pages 49-58

  Stoyanov, S ^a   Bailey, C ^a   Cross, M ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

Author keywords

Flip chip; Optimization; Reliability; Underfill

Indexed keywords

COMPUTER SIMULATION; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; FLIP CHIP DEVICES; OPTIMIZATION; RELIABILITY; STATISTICAL METHODS; TENSORS; THERMAL CYCLING;

SOFTWARE PACKAGE PHYSICA; UNDERFILL;

SOLDERED JOINTS;

EID: 0036240551     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910210416477     Document Type: Article

References (19)

1. Optimization of solder joint fatigue life using product model-based analysis models
2. Thermo-mechanical deformation of underfilled flip-chip packaging
3. Maximizing solder joint reliability through optimal shape design
4. Thermal fatigue analysis of a CBGA package with lead-free solder fillets
5. Influence of die size on the magnitude of thermo-mechanical stresses in flip chips directly attached to printed wiring board
6. Fine pitch stencil printing process modeling and optimization
7. Effect of material and geometry parameters on the thermo-mechanical reliability of flip-chip assemblies
8. Parametric study of flip chip reliability based on solder fatigue modelling
9. Recent advances in the development of no-flow underfill encapsulants - A practical approach towards the actual manufacturing application
10. Study on the correlation of flip chip reliability with mechanical properties of no-flow underfill materials
11. Integrating computational mechanics and numerical optimization for the design of material properties in electronic packages
12. Solution of the elastic/visco-plastic constitutive equations: A finite volume approach
13. High performance no-flow underfills for low-cost flip-chip applications: Material characterization