Flattening mechanism in thermal sprayed nickel particle impinging on flat substrate surface

Journal of Thermal Spray Technology

Volumn 8, Issue 3, 1999, Pages 427-432

  Fukumoto, M ^a   Huang, Y ^a  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AUGER ELECTRON SPECTROSCOPY; GOLD; NICKEL; PARTICLES (PARTICULATE MATTER); PROTECTIVE COATINGS; RAPID SOLIDIFICATION; SCANNING ELECTRON MICROSCOPY; SUBSTRATES; THERMAL EFFECTS;

THERMAL SPRAYING;

SPRAYED COATINGS;

EID: 0032644538     PISSN: 10599630     EISSN: None     Source Type: Journal    
DOI: 10.1361/105996399770350386     Document Type: Article

References (11)

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3. M. Pasandideh-Fard and J. Mostaghimi, On the Spreading and Solidification of Molten Particles in a Plasma Spray Process: Effect of Thermal Contact Resistance, Plasma Chem. Plasma Process., Vol 16 (No. 1), 1996, p 83-98
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7. Y. Huang, M. Ohwatari, and M. Fukumoto, Effect of Substrate Material on Flattening Behavior of Plasma Sprayed Nickel Particles, The Role of Welding Science and Technology in the 21st Century, Proc. Int. Symp. Japan Welding Soc., M. Ushio, Ed., Vol 2, 1996, p 731-736
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9. M. Fukumoto, H. Hayashi, and T. Yokoyama, Relationship between Particle's Splat Pattern and Coating Adhesive Strength of HVOF Sprayed Cu-Alloy, J. Japan Therm. Spray Soc., Vol 32 (No. 3), 1995, p 149-156 (in Japanese)
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