Deformation and fracture in micro-tensile tests of freestanding electrodeposited nickel thin films

Scripta Materialia

Volumn 58, Issue 12, 2008, Pages 1062-1065

  Yang, Y ^a   Yao, N ^b   Soboyejo, W O ^b   Tarquinio, C ^c  

^a HONG KONG POLYTECHNIC UNIVERSITY   (Hong Kong)

^b Princeton University   (United States)

^c Evex Inc   (United States)

Author keywords

LIGA; Micromechanical modeling; Nickel; Tension test; Thin films

Indexed keywords

CONTINUUM MECHANICS; ELECTRODEPOSITION; FRACTURE; NICKEL COMPOUNDS;

FILM MICROSTRUCTURAL GRADIENTS; FRACTURE MECHANISMS; MICROMECHANICAL MODELING; THICKNESS EFFECT;

THIN FILMS;

EID: 42149099893     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2008.01.049     Document Type: Article

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