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Volumn 6894, Issue , 2008, Pages
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Progress in GaN devices performances and reliability
a a a a a a a a b b c d d e e f
d
IQE INC
(United States)
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Author keywords
AlGaN GaN; DARPA MTO; GaN; MMIC
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Indexed keywords
(+ MOD 2N) OPERATION;
(E ,2E) THEORY;
ASSOCIATED GAIN;
BAE SYSTEMS (CO);
CHANNEL TEMPERATURE;
COMMERCIAL APPLICATIONS;
CRITICAL COMPONENTS;
DRAIN EDGE;
LOCKHEED-MARTIN (CO);
MANUFACTURABILITY;
NITRIDE MATERIALS;
OPTICAL INSTRUMENTATION;
PIEZO-ELECTRIC EFFECTS;
PLATE STRUCTURES;
POWER DENSITY (PD);
RF RELIABILITY;
RF TECHNOLOGIES;
TRIQUINT SEMICONDUCTOR (CO);
WIDE-BAND-GAP SEMICONDUCTORS;
ACTIVATION ENERGY;
CHEMICAL ACTIVATION;
COMPUTER NETWORKS;
CUBIC BORON NITRIDE;
DEGRADATION;
ELECTRIC CONDUCTIVITY;
ELECTRIC FIELDS;
ELECTROACUPUNCTURE;
ELECTROMAGNETIC FIELD THEORY;
ELECTROMAGNETIC FIELDS;
ELECTROMAGNETISM;
GALLIUM;
GALLIUM ALLOYS;
GALLIUM COMPOUNDS;
GALLIUM NITRIDE;
MAGNETISM;
MICROFLUIDICS;
MOSFET DEVICES;
NANOSTRUCTURED MATERIALS;
NITRIDES;
PIEZOELECTRICITY;
PIGMENTS;
PLATES (STRUCTURAL COMPONENTS);
SEMICONDUCTOR DEVICE MANUFACTURE;
SEMICONDUCTOR DEVICES;
SEMICONDUCTOR MATERIALS;
SULFATE MINERALS;
TECHNOLOGY;
SEMICONDUCTING GALLIUM;
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EID: 42149096491
PISSN: 0277786X
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1117/12.765467 Document Type: Conference Paper |
Times cited : (2)
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References (5)
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