Risk-averse reliability optimisation in electronic product design with component and non-component failures

International Journal of Product Development

Volumn 5, Issue 1-2, 2008, Pages 93-108

  Jin, Tongdan ^a   Liao, Haitao ^b   Wang, Peng ^c  

^a TERADYNE INC   (United States)

^b WICHITA STATE UNIVERSITY   (United States)

^c UNITED TECHNOLOGIES RESEARCH CENTER   (United States)

Author keywords

Component failure; Electronic product; Genetic algorithm; Mean time between failures; MTBF; Non component failure; Reliability optimisation

Indexed keywords

EID: 42049087847     PISSN: 14779056     EISSN: 17418178     Source Type: Journal    
DOI: 10.1504/IJPD.2008.016372     Document Type: Article

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