Minimize system reliability variability based on six-sigma criteria considering component operational uncertainties

Proceedings - Annual Reliability and Maintainability Symposium

Volumn , Issue , 2005, Pages 214-219

  Jin, Tongdan ^a,b   Su, Peter ^a,b  

^a TERADYNE INC   (United States)

^b NONE   (United States)

Author keywords

Device failure rate; Electrical derating; Temperature variation

Indexed keywords

ELECTRONIC EQUIPMENT; FAILURE ANALYSIS; RANDOM PROCESSES; STRESSES; SYSTEMS ANALYSIS; THERMAL EFFECTS; CAPACITORS; MATHEMATICAL MODELS; PRINTED CIRCUIT BOARDS; RELIABILITY; UNCERTAIN SYSTEMS;

DEVICE FAILURE RATE; ELECTRICAL DERATING; ELECTRICAL STRESSES; TEMPERATURE VARIATION;

RELIABILITY; SYSTEMS ANALYSIS;

EID: 27744496160     PISSN: 0149144X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. B. Edson, X. Tian, A Prediction Based Design-For-Reliability Tool, Proceeding of Annual Reliability and Maintainability Symposium, January 2004.
2. Bellcore, Reliability Prediction Procedure for Electronic Equipment, SR-332, Issue 5, Dec 1995.
3. Feger, C. R., Strange, T. R. Life Testing of Aluminum Electrolytics and the End of Life Dilemma, http://www.ec-central.org/magazine/nov_dec_02/ tech_paper_lifetesting.pdf.
4. Reliasoft Corporation, Accelerated Life Testing Reference, from www.weibull.com.
5. Fenn Jason, Electronic Component Reliability, John Wiley & Sons, 1995.