Plated through-hole vias in a porous polyimide foil for flexible printed circuit boards

Journal of Micromechanics and Microengineering

Volumn 18, Issue 1, 2008, Pages

  Yousef, Hanna ^a   Hjort, Klas ^a   Lindeberg, Mikael ^a  

^a UPPSALA UNIVERSITY   (Sweden)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; ELECTRODEPOSITION; HEAVY IONS; ION BOMBARDMENT; METAL FOIL; METALLIZING; PHOTORESISTS; POROSITY; POROUS MATERIALS; PRINTED CIRCUIT BOARDS; THIN FILMS;

FILTER MEMBRANES; PORE DENSITY; POROUS KAPTON FOIL; THIN FILM METALLIZATION;

POLYIMIDES;

EID: 41849104514     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/1/017001     Document Type: Article

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