Lowering the sintering temperature for EPD coatings by applying reaction bonding

Journal of the European Ceramic Society

Volumn 28, Issue 9, 2008, Pages 1793-1799

  Baufeld, Bernd ^a   van der Biest, Omer ^a   Rätzer Scheibe, Hans Joachim ^b  

^a UNIVERSITY OF LEUVEN   (Belgium)

^b GERMAN AEROSPACE CENTER DLR   (Germany)

Author keywords

Electrophoretic deposition; Porosity; Suspension; Thermal conductivity; ZrO2

Indexed keywords

BONDING; CERAMIC COATINGS; ELECTRODEPOSITION; POROSITY; SINTERING; TEMPERATURE DISTRIBUTION; THERMAL BARRIER COATINGS; THERMAL CONDUCTIVITY; ZIRCONIA;

ELECTROPHORETIC DEPOSITION; SINTERING TEMPERATURE; ZIRCONIUM NITRIDE;

ELECTROPHORETIC COATINGS;

BONDING; CERAMIC COATINGS; ELECTRODEPOSITION; ELECTROPHORETIC COATINGS; POROSITY; SINTERING; TEMPERATURE DISTRIBUTION; THERMAL BARRIER COATINGS; THERMAL CONDUCTIVITY; ZIRCONIA;

EID: 41749093197     PISSN: 09552219     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jeurceramsoc.2007.11.019     Document Type: Article

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