Ultra-fast negative bias temperature instability monitoring and end-of-life projection

IEEE International Integrated Reliability Workshop Final Report

Volumn , Issue , 2006, Pages 136-138

  Wang, Chi Shiun ^a   Chang, Wen Chun ^a   Ke, Wen Shawn ^a   Su, Kuan Cheng ^a  

^a UNITED MICROELECTRONICS CORPORATION   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATION; CMOS INTEGRATED CIRCUITS; MATHEMATICAL MODELS; MOSFET DEVICES; STRESS ANALYSIS;

DEVICE JUNCTIONS; TEMPERATURE INSTABILITY; TEST STRUCTURES;

TEMPERATURE MEASUREMENT;

EID: 41649118432     PISSN: 19308841     EISSN: 23748036     Source Type: Conference Proceeding    
DOI: 10.1109/IRWS.2006.305228     Document Type: Conference Paper

References (7)

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7. Andrea Scarpa, Guoqiao Tao and Fred G. Kuper, "Wafer level reliability monitoring strategy of an advanced multi-process CMOS foundry", IEEE Int. Reliability Phys. Symp., pp.602-603, 2003.