Double patterning lithography: The bridge between low k1 ArF and EUV

Microlithography World

Volumn 17, Issue 1, 2008, Pages

  Finders, Jo ^a   Dusa, Mircea ^b   Hsu, Stephen ^c  

^a ASML   (Netherlands)

^b ASML US Inc   (United States)

^c Brion Technologies Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DEPOSITION; ETCHING; FITS AND TOLERANCES; INTEGRATED CONTROL; MATHEMATICAL MODELS; SUBSTRATES;

DOUBLE PATTERNING LITHOGRAPHY; ETCH FINGERPRINT; FILM DEPOSITION; SACRIFICIAL LAYER PATTERNING;

LITHOGRAPHY;

EID: 41449114142     PISSN: 1074407X     EISSN: None     Source Type: Trade Journal    
DOI: None     Document Type: Article

References (10)

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5. M. Maenhoudt et al., SPIE, Vol. 5754, pp.1508-1519, 2004.
6. W. Arnold et al., "Manufacturing Challenges in Double Patterning Lithography," ISSM-2006 MC-233, October 2006.
7. M. Dusa et al., SPIE, Vol. 6520, 65200G, 2007.
8. Bert Vleeming et al., "Sub-32nm Half-pitch Imaging with High NA Immersion Exposure Systems Using Double Patterning Techniques," 4th International Symposium on Immersion Lithography, Keystone CO, 2007; https://www.sematech.org/8065/pres/DO-01%20Vleeming_ASML.pdf.
9. K. Bubke et al., SPIE, Vol. 6730, 67301H, 2007.
10. Stephen D. Hsu, et al., SPIE, Vol. 5992, pp. 557-572, 2005.