Thermal strain measurement on electronic packages using digital image correlation method

Zairyo/Journal of the Society of Materials Science, Japan

Volumn 57, Issue 1, 2008, Pages 83-89

  Shishido, Nobuyuki ^a   Ikeda, Toru ^a   Miyazaki, Noriyuki ^a   Nakamura, Kentaro ^b   Miyazaki, Masashi ^b   Sawatari, Tatsuro ^b  

^a KYOTO UNIVERSITY   (Japan)

^b Central R and D Laboratories   (Japan)

Author keywords

Calibration; Digital image correlation; Electronic package; Lens aberration; Thermal strain

Indexed keywords

ABERRATIONS; CALIBRATION; CORRELATION METHODS; FINITE ELEMENT METHOD; IMAGE ACQUISITION; LENSES; PRINTED CIRCUIT BOARDS; STRAIN MEASUREMENT; THERMAL EFFECTS;

DIGITAL IMAGE CORRELATION; ELECTRONIC PACKAGES; LENS ABERRATION; THERMAL STRAIN;

ELECTRONICS PACKAGING;

EID: 41149173574     PISSN: 05145163     EISSN: None     Source Type: Journal    
DOI: 10.2472/jsms.57.83     Document Type: Article

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