A new micromachined sensor system for tactile measurements of high aspect ratio microstructures

Microsystem Technologies

Volumn 14, Issue 4-5, 2008, Pages 543-549

  Balke, M ^a   Peiner, E ^a   Doering, L ^b  

^a TECHNICAL UNIVERSITY OF BRAUNSCHWEIG   (Germany)

^b PHYSIKALISCH TECHNISCHE BUNDESANSTALT   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; MICROMACHINING; MICROMETERS; MICROSTRUCTURE; SILICON;

MICROMACHINED SENSOR SYSTEM; TACTILE MEASUREMENTS;

SENSORS;

EID: 41149153427     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-007-0452-8     Document Type: Conference Paper

References (6)

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2. Kozlovskiy SI, Boiko II (2005) First-order piezoresistance coefficients in silicon crystals. Sens Actuators A 118:33-43
3. Powell O, Harrison HB (2001) Anisotropic etching of {100} and {110} planes in (100) silicon. J Micromech Microeng 11:217-220
4. Tortonese M, Barrett RC, Quate CF (1993) Atomic resolution with an atomic force microscope using piezoresistive detection. Appl Phys Lett 62(8):234-236
5. Wilke N, Morrissey A, Ye S, O'Brian J (2004) Fabrication and characterisation of microneedle electrode arrays using wet etch technologies. EMN04, 20-21 October 2004, Paris, France
6. Wilke N, Reed ML, Morrissey A (2006) The evolution from convex corner undercut towards microneedle formation: theory and experimental verification. J Micromech Microeng 16:808-814