Active packaging method for light-emitting diode lamps with photosensitive epoxy resins

IEEE Photonics Technology Letters

Volumn 20, Issue 2, 2008, Pages 87-89

  Wang, Hao ^a   Lee, Kyu Seung ^a   Ryu, Jae Hyoung ^b   Hong, Chang Hee ^b   Cho, Yong Hoon ^a  

^a Chungbuk National University   (South Korea)

^b Chonbuk National University   (South Korea)

Author keywords

Encapsulation; Light emitting diode (LED); Photosensitive epoxy resins; Semiconductor device packaging

Indexed keywords

ACTIVE PACKAGING; EMISSION PROPERTIES; LED CHIPS; LED LAMPS; PACKAGING METHODS; PHOTOSENSITIVE EPOXY; POLYMERIZATION METHOD; POLYMERIZATION TIME; SELF-FOCUSING EFFECTS; SEMICONDUCTOR DEVICE PACKAGING;

CHIP SCALE PACKAGES; DIODES; EPOXY RESINS; LIGHT EMISSION; LIGHT SENSITIVE MATERIALS; LIGHTING; PACKAGING; PHOTOSENSITIVITY; POLYMERIZATION; POLYMERS; RESINS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DIODES; SEMICONDUCTOR SWITCHES;

LIGHT EMITTING DIODES;

EID: 41049090769     PISSN: 10411135     EISSN: None     Source Type: Journal    
DOI: 10.1109/LPT.2007.910760     Document Type: Article

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