Electroplating silver tetracyanoquinodimethane between gold micro-gap electrodes for the fabrication of coplanar devices, a new way to integrate material synthesis and devices fabrication within one step

Applied Physics A: Materials Science and Processing

Volumn 91, Issue 2, 2008, Pages 301-303

  Ji, Zhuoyu ^a,b   Li, Hongxiang ^a   Liu, Yaling ^a,b   Hu, Wenping ^a  

^a INSTITUTE OF CHEMISTRY   (China)

^b UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

[No Author keywords available]

Indexed keywords

CHARGE TRANSFER; ELECTROCHEMISTRY; ELECTRODES; ELECTROPLATING; GOLD;

COPLANAR DEVICES; MICRO-GAP ELECTRODES;

SILVER COMPOUNDS;

EID: 40949149456     PISSN: 09478396     EISSN: 14320630     Source Type: Journal    
DOI: 10.1007/s00339-008-4399-0     Document Type: Article

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