Challenges in etch: What's new?

Thin Solid Films

Volumn 516, Issue 11, 2008, Pages 3493-3496

  Gottscho, Richard A ^a   Nojiri, K ^b   LaCara, J ^a  

^a LAM RESEARCH CORPORATION   (United States)

^b Lam Research Co Ltd   (Japan)

Author keywords

193 nm resist; 45 nm technology; Pattern density; Strained silicon

Indexed keywords

COST REDUCTION; ETCHING; SILICON;

PATTERN DENSITY; STRAINED SILICON;

THIN FILMS;

EID: 40649104584     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2007.08.105     Document Type: Article

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