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Volumn 22, Issue 7, 1999, Pages
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HASL alternatives
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL FINISHING;
COATING TECHNIQUES;
COST EFFECTIVENESS;
ELECTRONICS PACKAGING;
ENVIRONMENTAL IMPACT;
ENVIRONMENTAL PROTECTION;
PRODUCTIVITY;
VALUE ENGINEERING;
HOT AIR SOLDER LEVEL (HASL) DEPOSITS;
ORGANIC SOLDERABILITY PRESERVATIVES (OSP);
PRINTED CIRCUIT MANUFACTURE;
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EID: 0032644309
PISSN: 02748096
EISSN: None
Source Type: Journal
DOI: None Document Type: Article |
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Times cited : (4)
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References (0)
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