Improving the electrical performance of Cu/CVD low k coral™ interconnection- An exploration of SiC cap etch and Ta diffusion barrier deposition

Advanced Metallization Conference (AMC)

Volumn , Issue , 2003, Pages 91-96

  Tsang, C F ^a   Li, C Y ^a   Li, H Y ^a   Bliznetsov, V ^a   Su, Y J ^a  

^a INSTITUTE OF MICROELECTRONICS   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

CAP ETCH TIME; ELETRICAL PERFORMANCE; IONIZED METAL PLASMA (IMP); THREE-WAY SPLIT;

CHEMICAL VAPOR DEPOSITION; ELECTRIC BREAKDOWN; ELECTRODEPOSITION; ETCHING; PERMITTIVITY; POTASSIUM; SILICON COMPOUNDS;

COPPER;

EID: 4043056659     PISSN: 15401766     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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